WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
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3D Stacking Packaging Engineer (PMTS)
THE PERSON
The candidate should have a proven track record and extensive knowledge/experience in wafer process Integration, such as BEOL Integration, 3D integration with TSV and Hybrid Bonding (CoW and W2W) etc. The candidate should have a hands-on approach to process bring up and development as well as excellent oral and written communication skills to communicate ideas with Technology Partners, Colleagues, Product Architects and AMD Management.
KEY RESPONSIBILITIES
- Drive/participate in defining FMEA, TV Design, DFM, and DFY. Manage DOE plan and execution for material selections, process window validation. Defining quality and reliability tests including defect detection and FA methodology
- Enable development partners in the AMD Ecosystem to bring up new packaging technology/process from concept to NPI and prototyping to mass production. lead and perform process optimization, yield and reliability improvement.
- Transfer the new product into a high yielding, cost-effective, high-volume manufacturing environment.
- Partner with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions which meet product requirements.
PREFERRED EXPERIENCE
- Fundamental knowledge and hand-on experience with BEOL process, TSV integration and Hybrid bonding process and defect metrology.
- Good knowledge in design and reliability, such as TV design, CPI, Thermo-mechanical analysis, DFR etc.
- Good knowledge with Advanced Packaging Techniques, including fan-out, 3D stacking, 2.5D and MCM packaging techniques;
- 10+ years' experience in the industry with strong problem solving, communication, organizational, interpersonal, and presentation skills.
ACADEMIC CREDENTIALS
- Master of Science/PhD in materials, mechanical, chemical, or electrical engineering.
Location
Austin, TX
#LI-RD1
#LI-HYBRID
At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
3D Stacking Packaging Engineer (PMTS)
THE PERSON
The candidate should have a proven track record and extensive knowledge/experience in wafer process Integration, such as BEOL Integration, 3D integration with TSV and Hybrid Bonding (CoW and W2W) etc. The candidate should have a hands-on approach to process bring up and development as well as excellent oral and written communication skills to communicate ideas with Technology Partners, Colleagues, Product Architects and AMD Management.
KEY RESPONSIBILITIES
- Drive/participate in defining FMEA, TV Design, DFM, and DFY. Manage DOE plan and execution for material selections, process window validation. Defining quality and reliability tests including defect detection and FA methodology
- Enable development partners in the AMD Ecosystem to bring up new packaging technology/process from concept to NPI and prototyping to mass production. lead and perform process optimization, yield and reliability improvement.
- Transfer the new product into a high yielding, cost-effective, high-volume manufacturing environment.
- Partner with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions which meet product requirements.
PREFERRED EXPERIENCE
- Fundamental knowledge and hand-on experience with BEOL process, TSV integration and Hybrid bonding process and defect metrology.
- Good knowledge in design and reliability, such as TV design, CPI, Thermo-mechanical analysis, DFR etc.
- Good knowledge with Advanced Packaging Techniques, including fan-out, 3D stacking, 2.5D and MCM packaging techniques;
- 10+ years' experience in the industry with strong problem solving, communication, organizational, interpersonal, and presentation skills.
ACADEMIC CREDENTIALS
- Master of Science/PhD in materials, mechanical, chemical, or electrical engineering.
Location
Austin, TX
#LI-RD1
#LI-HYBRID