WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance_
THE ROLE:
We are looking for a candidate that can drive our EDA roadmap and technically lead our Package CAD team to develop and maintain world-class package design flows. You will collaborate with our internal experts and EDA vendors to plan and drive continuous methodologies improvements, collecting best practices and integrate them into a software designed flow for consistency, efficiency, and ease-of-use. You will manage your team to provide tools/flows support to the global package design teams and work with EDA vendors to resolve tool issues.
THE PERSON:
The successful candidate must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good executive presentation & communication skills. Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to grow in people management ladder.
KEY RESPONSIBILITIES:
- Drive for supplier engagement on continuous improvement and new capabilities ahead of need
- Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders
- Drive external manufacturer on issue resolution and issue prevention.
- Lead, plan and execute change management from internal or external parties
- Involved in regional supplier management – drive to meet Key Performance Indices
- Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio
- Prepare & present Executive Summary of projects and supplier’s performance
- Coordination of activities within/external team to deliver critical metrics
- Overseas travelling as required
PREFERRED EXPERIENCE:
- Strong knowledge in Flip Chip Packaging (while operational experience in bumping process, substrate manufacturing, Assembly manufacturing, lid & stiffener manufacturing process is an added advantage)
- Track record of development work leading to volume production in Semiconductor manufacturing
- Good leadership and interpersonal skills
- Team Leadership
- Familiar with tools (JMP, minitab, failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive)
ACADEMIC CREDENTIALS:
- Bachelor/MS degree in Mechanical or Material or Chemical Engineering
#LI-SC1
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
THE ROLE:
We are looking for a candidate that can drive our EDA roadmap and technically lead our Package CAD team to develop and maintain world-class package design flows. You will collaborate with our internal experts and EDA vendors to plan and drive continuous methodologies improvements, collecting best practices and integrate them into a software designed flow for consistency, efficiency, and ease-of-use. You will manage your team to provide tools/flows support to the global package design teams and work with EDA vendors to resolve tool issues.
THE PERSON:
The successful candidate must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good executive presentation & communication skills. Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to grow in people management ladder.
KEY RESPONSIBILITIES:
- Drive for supplier engagement on continuous improvement and new capabilities ahead of need
- Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders
- Drive external manufacturer on issue resolution and issue prevention.
- Lead, plan and execute change management from internal or external parties
- Involved in regional supplier management – drive to meet Key Performance Indices
- Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio
- Prepare & present Executive Summary of projects and supplier’s performance
- Coordination of activities within/external team to deliver critical metrics
- Overseas travelling as required
PREFERRED EXPERIENCE:
- Strong knowledge in Flip Chip Packaging (while operational experience in bumping process, substrate manufacturing, Assembly manufacturing, lid & stiffener manufacturing process is an added advantage)
- Track record of development work leading to volume production in Semiconductor manufacturing
- Good leadership and interpersonal skills
- Team Leadership
- Familiar with tools (JMP, minitab, failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive)
ACADEMIC CREDENTIALS:
- Bachelor/MS degree in Mechanical or Material or Chemical Engineering
#LI-SC1