WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance_
THE ROLE:
We are looking for a candidate who can manage and drive external suppliers on delivering or exceeding target performance in New Product Introduction, Supplier Manufacturing Operations, Quality and Reliability issue free processes, and Pathfinding new capabilities. AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology!
THE PERSON:
The successful candidates must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment. He or she would have in-depth technical knowledge, excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good presentation & communication skills. Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to develop a career in AMD.
KEY RESPONSIBILITIES:
- Drive IC packaging initiatives from product qualification to high volume ramp for next generation FCBGA & Advance Package (CoWoS, 2.5DIC, 3DIC, InFO, SoIC…) devices
- Collaborate with foundry and OSAT suppliers to define process flow and process control to enable high volume manufacturing.
- Drive manufacturing process quality through FMEA and lead comprehensive reliability evaluations to determine the quality and reliability margin for the product.
- Drive data analytics program and detect manufacturing and product quality excursion to safeguard product quality.
- Research and develop solutions to enhance package reliability for end users.
- Innovate methods to add more value to the product through optimizing product cost, yield and performance.
- Leads establishment, review and audit of manufacturing specification, control plan and FMEA for all assembly & substrate suppliers.
- Lead collaboration with suppliers to meet AMD's goals (cost, yield, quality and reliability) and continuous improvement activities.
- Lead investigations, risk assessments on quality activities including PCN, lot on holds, issues including MRB, customer complaints, RMA.
PREFERRED EXPERIENCE:
- Strong knowledge in end to end of FCBGA & Advance Package (CoWoS, 2.5DIC, 3DIC, InFO, SoIC…) assembly process.
- Strong knowledge in FMEA & Control Plan methodology
- Strong knowledge in data analysis tools (JMP, Snowflake, Power BI…etc.)
- Experience on substrate, bump and assembly integration
- Strong leadership and interpersonal skills with effective communication & presentation skills
- Track record of development work leading to volume production in Semiconductor manufacturing
- Familiar with tools (failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive)
ACADEMIC CREDENTIALS:
- Bachelor/MS degree in Engineering
LOCATION:
Taichung, Taiwan
#LI-SC1
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
THE ROLE:
We are looking for a candidate who can manage and drive external suppliers on delivering or exceeding target performance in New Product Introduction, Supplier Manufacturing Operations, Quality and Reliability issue free processes, and Pathfinding new capabilities. AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology!
THE PERSON:
The successful candidates must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment. He or she would have in-depth technical knowledge, excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good presentation & communication skills. Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to develop a career in AMD.
KEY RESPONSIBILITIES:
- Drive IC packaging initiatives from product qualification to high volume ramp for next generation FCBGA & Advance Package (CoWoS, 2.5DIC, 3DIC, InFO, SoIC…) devices
- Collaborate with foundry and OSAT suppliers to define process flow and process control to enable high volume manufacturing.
- Drive manufacturing process quality through FMEA and lead comprehensive reliability evaluations to determine the quality and reliability margin for the product.
- Drive data analytics program and detect manufacturing and product quality excursion to safeguard product quality.
- Research and develop solutions to enhance package reliability for end users.
- Innovate methods to add more value to the product through optimizing product cost, yield and performance.
- Leads establishment, review and audit of manufacturing specification, control plan and FMEA for all assembly & substrate suppliers.
- Lead collaboration with suppliers to meet AMD's goals (cost, yield, quality and reliability) and continuous improvement activities.
- Lead investigations, risk assessments on quality activities including PCN, lot on holds, issues including MRB, customer complaints, RMA.
PREFERRED EXPERIENCE:
- Strong knowledge in end to end of FCBGA & Advance Package (CoWoS, 2.5DIC, 3DIC, InFO, SoIC…) assembly process.
- Strong knowledge in FMEA & Control Plan methodology
- Strong knowledge in data analysis tools (JMP, Snowflake, Power BI…etc.)
- Experience on substrate, bump and assembly integration
- Strong leadership and interpersonal skills with effective communication & presentation skills
- Track record of development work leading to volume production in Semiconductor manufacturing
- Familiar with tools (failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive)
ACADEMIC CREDENTIALS:
- Bachelor/MS degree in Engineering
LOCATION:
Taichung, Taiwan
#LI-SC1